Description
Shenzhen Danbond Technology Co Ltd is a Chinese company engaged in the research and development, and manufacturing of flexible circuit and its materials. Its main products include flexible FCCL, high-intensity FPC, COF circuit for chips encapsulation, encapsulation products, flexible circuits, encapsulation-related heat curing adhesive and micro adhesive glue film. The products have application in commercial electronics, medical device, special computer, digital display, high-tech equipping industry, national defense, military, and airspace industry.
